Indian Institute of Technology Jodhpur Invites Application for Junior Research Fellow Recruitment 2021

Vacancy Circular No:

Indian Institute of Technology Jodhpur (IIT Jodhpur)
invites applications for recruitment of Junior Research Fellow

Junior Research Fellow

Job Location:

Old Residency Road Ratanada
342 011, Jodhpur, Rajasthan

Last Date: 30 October 2021

Employment Type: Full Time

Number of Vacancies: 1 Posts

Educational Qualification: B.Tech/B.E, M.E/M.Tech

Applications are invited from the citizen of India for filling up the following temporary position in the Sponsored Research Project at this Institute. The position is purely temporary, initially for a period of 09 months, and extendable but co-terminus with the duration of the project, on a contractual basis with consolidated pay. The requisite qualification, experience, and other details are given below:

1. Project No. S/SERB/DA/20200044

2. Project Title: Controlled Morphologies via Phase-separation in Epoxy Blends for Electronic Sensor & Device Packaging

3. Name of the Project Investigator Dr. Deepak Arora

4. Duration of Initial Appointment 09 Months

5. Post Name: Junior Research Fellow

6. No. of Post: 01

7. Consolidate Pay Rs.31,000/-

8. Essential Qualification: B.E./ B.Tech. in a relevant discipline such as Chemical Engineering, Materials Engineering, Polymer Science & Engineering, Electrical Engineering, Packaging Engineering, etc, and NET/ GATE qualified.

9. Experience: Courses Done in fundamentals of polymers

10. Desirable: B.E./ B.Tech + M.E./ M.Tech. or higher degree in a relevant discipline such as Chemical Engineering, Materials Engineering, Polymer Science & Engineering, Electrical Engineering, Packaging Engineering, etc.

11. Experience: Advanced courses are done in polymers, polymer rheology, epoxies, and relevant domains. Hands-on laboratory experience in polymer synthesis and formulation. Hands-on experience in device/ sensor fabrication. Experienced with equipment such as spin coater, rheometer, DSE, DMA, SEM, AFM optical microscope, FTIR, etc Experience with microfabrication.

12. Job Description: A Junior research fellow will help in executing the research project and relevant work in the area of cross-linking of epoxy blends. The person will be involved in manuscript preparation for submission to journals and conferences. Helping in the procurement of equipment and accessories, and the testing and installation.

13. Brief description of Project Electronic packaging involves packing a semiconductor device, such as chip, memory, photodiodes, LED, etc. with various other components, in an organic, ceramic, or composite environment. Electronic packages find their application in traditional industries including computing, automotive, aerospace, and mobile.

a. The advent of new industries as artificial intelligence, autonomous cars, smart homes, smart cities, and the Internet of Things (IoT) has provided a renewed thrust to electronic packaging. This has pushed the requirements for reliability and performance in terms of tighter feature dimensions for dense packages. This imposes additional requirements on the polymer dielectrics that are implemented in the manufacturing of electronic packages.

b. In particular, polymer dielectrics are expected to have better rheological and mechanical properties, higher glass transition temperatures, better elongation, and improved adhesion with various interfaces while offering ease of processing and the benefits of low cost. Epoxy resins are some of the crucial polymeric resins for the electronic packaging and semiconductor industry. Understanding the phase- separation for epoxy resins is vital in realizing the above-mentioned requirements. Some of the functionalities of epoxies in electronic packaging are,

i) Adhesion layers;

ii) Insulation layers;

iii) Constituent of photosensitive materials;

iv) Stress-relief layers (underfills). Adhesion between polymers and the inorganic layers is key to the reliability of a device, and typically it is improved by modulating the surface morphology. The objective of this research proposal is to understand the fundamentals of phase separation in epoxy blends that will help us enable next-generation requirements including, i) Finer features; ii) Thinner dielectric layers; iii) Thinner conducting layers; iv) Improved performance via reduced transmission losses and, v) Reduced metal migration. A dual-pronged approach, comprising of fundamental material characteristics and thorough characterization of morphologies will be implemented in this research.

c. We will formulate epoxy blends using polymers with varying chain length and functionality, that will be analyzed using techniques including Differential Scanning Calorimetry (DSC), Shear rheometry, Dynamic Mechanical Analyzer (DMA), Atomic Force Microscopy (AFM), and Scanning Electron Microscope (SEM). Under the mission of “Developing Low Cost Highly Reliable and High Performing Polymeric Materials & Technologies for Packaging of Electronic Devices”, one of our objectives is to design Advanced Epoxy Composites for Future Generations of Device Packaging.

d. This proposal focuses on understanding the Fundamentals of Phase-separation in Epoxy Blends and its impact on Structure-Property. It will also establish an understanding of composition and corresponding morphology for epoxy blends with a long-term vision to develop epoxy composites and packaging solutions for devices and sensors.

Pay Scale:
INR
31000(Per Month)

Age Limit: Maximum age 30 Years

Selection Procedure

Selection Will be Based either Written Exam/Interview

How to Apply:

1. The candidates possessing the requisite qualification and experience should apply through the Online process up to 30 October 2021. The candidates are advised to send a soft copy of the application with all relevant documents to recruitment_rnd@iitj.ac.in (Please mention the advertisement number in the subject line of the email). No need to send a hard copy.

2. Advt. No.: IITJ/R&D/2021-22/28

Important Dates:

Published on: 06 October 2021

The last date for application is: 30 October 2021

For more details, please refer to official notification at Download Official Notification